A.Equipment overview
1.1 Application field: It is suitable for non-contact chip off of wafer on ceramic disk after wafer polishing.
1.2 Name: Non-contact wafer feeder
1.3 Model: XP-8
1.4 Dimensions: Length 1190mm* Width 600mm* height 1120mm
1.5 Wafer size: 2-6 inches
B.Main technical parameters
Project | Main performance indicators and parameters |
Machine dimension | 2-6 inch discs |
Ceramic disc diameter | 485mm (Different sizes of plates, need to replace different fixtures) |
Number of ceramic table (PCS) | 1 |
Next film station | 2 |
Single tablet time | 4 inches 30 seconds per piece |
Number of films per shot | 1片 |
Equipment Dependent Update (%; Average) | 95% |
Water supply | Greater than 0.3Mpa, pipe interface 1/2 (internal thread) |
Air supply | 0.25-0.3Mpa, pipe interface Φ10mm |
Pipeline flow | 25L/Min |
Monolithic water | 2.5-4L/piece |
Overflow tank volume | 46L (Spray water will go directly to the overflow tank to achieve circulation) |
Nitrogen pressure | 0.25-0.3Mpa, nitrogen pipe connector 3/8" |
Drain pipe | 40mm round tube PP tube |
Control system | Programmable controller |
display | 4.3-inch touch screen |
Power supply | AC220V |
Machine overall power | 2KW |
Dimensions（D*W*H）mm | D 1190mm*W 600mm*H 1120mm |